Chip Quik TC4-10G Heat Sink Thermal Compound - Deep-Space Liquid Metal 79 W/mK 10g/3cc Syringe

Lead-Free / RoHS 3 Compliant / REACH Compliant Description CHIPQUIK Deep-Space Liquid Metal Thermal Compound. Liquid Metal, non-curing, flowable, thermally conductive heat sink compound. Pure Liquid Metal. Provides extremely high thermal conductivity of 79 W/mK, low bleed and high temperature stability. Electrically Conducting. Alloy contains Gallium and is not compatible with Aluminum Heat Sinks. Specifications Alloy: 100% Deep-Space Liquid Metal Pure Metal Proprietary Formula Heat Sink Material Compatibility: Nickel-Plated Copper, Nickel, Copper Heat Sink Material Incompatibility: Aluminum (Do Not Use with Aluminum Heat Sinks) Density: 6.8g/cc Thermal Conductivity: 79 W/mK Thermal Resistance: 0.003 C*cm2/W Operating Temperature (Continuous): -40 to 150C (-40 to 302F) Operating Temperature (Peak): 200C (392F) Size: 10g/3cc Manual Syringe w/ 2x 25-gauge tips, squeegee Application Instructions Apply sparingly with provided tips. Thinly spread using provided squeegee. Deep-Space Liquid Metal is highly conductive and is designed to fill all small cracks and crevices in surfaces to achieve extremely high thermal conductivity. Deep-Space Liquid Metal is thermally and electrically conductive, avoid getting it on electrical pins/pads/traces/BGA balls. Storage and Handling Store at room temperature 20-25C (68-77F). Shelf Life >60 months Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.

• Solder Paste