K4-PRO 500g high Thermal Conductivity Thermal Paste K 4,6 W/m.K for Computer heatsinks CSGR

K4-PRO low viscosity thermal paste is developed and produced by Computer Systems laboratories research department. This product was developed as part of C.S. Labs BGA rework research project with the support of Greece and Europian Union. This product is designed to reduce the chances of BGA component failure for reasons related to overheating. This listing is offering 500g of K4-PRO thermal paste. On each application less than 0.2g of K4-PRO is needed so this quantity should be enough for more than 2500 applications!!! When you should replace the thermal paste / pads in your computer: Thermal paste and thermal pads should be replaced every time that the heat sink is removed (for cleaning, upgrade or other maintenance). If your computer is overheated or turns off after a few hours of use. In this case the entire heatsink system must be cleaned immediately and all thermal paste and thermal pads must be replaced. K4-PRO is produced in τηε EU Thessaloniki Greece, CSGR.

• K4-PRO is a high quality thermal paste designed for use on computer BGA components (GPU, CPU, etc).
• K4-PRO has thermal conductivity K>4,6 W/m.K (3 times higher than common thermal pastes that are used on computers and comercial electronics) Computer Systems materials science laboratory testing : Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014)
• K4-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 220 degrees (Celcium) and has a long operational life time (practically infinite)
• K4-PRO is produced in EU (Thessaloniki, Greece).
• K4-PRO is a very low viscosity thermal paste (especially when heated during firs use). It will cover the invisible gaps between heatsink and component perfectly.